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Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
standard by BSI Group, 05/31/2014
Cross References:
IEC 60068-1
IEC 60068-2-2
IEC 60068-2-30
IEC 60068-2-38
IEC 60068-2-66
IEC 60068-2-67
IEC 60068-2-78
IEC 60068-3-5
IEC 60068-3-6
IEC 60194
IEC 60749-4
ISO 4677-1
ISO 9455
ISO 9455-17
ANSI/ASQ Z1.4
ANSI/ASQ Z1.9
ANSI J STD 004
EIAJ ED-4701/100
EIAJ ED-4701/102
EIAJ D-4701/301
IPC J-STD-004
IPC-TM-650
IPC-TR-476A
IPC-9201A
IPC-SM-840
JESD22-A101
JESD22-A102-C
JESD22-A110
JESD22-A110-B
JESD22-A113
JPCA BU 01
JPCA DG 02
JPCA ET 01
JPCA ET 06
JPCA ET 08
JPCA ET 09
JTM K 01
JTM K 07
MIL-HDBK-781A
MIL-STD-690
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
- Published:
- 05/31/2014
- ISBN(s):
- 9780580833397
- Number of Pages:
- 96
- File Size:
- 1 file , 3.8 MB
- Product Code(s):
- 30284927, 30284927, 30284927